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Hot Melt Molding Machine - List of Manufacturers, Suppliers, Companies and Products

Hot Melt Molding Machine Product List

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Nakatani's Hot Melt Molding: Molding Machine Edition

Collaboration with surrounding facilities and support for roll products! Selection is possible based on product specifications and material selection!

This is an introduction to Nakatani's "Hot Melt Molding" molding machine edition. Our company has over half a century of experience in plastic injection molding through the joint development of molding machines tailored to materials and molds. We accommodate a wide variety of materials and offer options for rotary and slide methods, which can be selected according to the sealing materials. 【Features】 ■ Hot melt dedicated machines: 5 units owned (the largest number in Japan) with clamping force from 1 ton to 40 tons ■ Plunger type (1 unit), screw type (3 units), pump type (1 unit): compatible with a variety of materials ■ Options for rotary and slide methods: can be selected according to sealing materials ■ Options for injection methods: horizontal and vertical ■ Small batch, diverse / large-scale equipment: from 1 to several hundred thousand units per month *For more details, please refer to the PDF materials or feel free to contact us.

  • Processing Contract
  • Surface treatment contract service

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Hot Melt Molding Case Study: "LED Module Waterproof Sealing"

LED module waterproof sealing! A case of process improvement through switching from potting.

Hot melt molding is a molding technology that involves injecting a solvent-free, one-component thermoplastic hot melt adhesive into a mold under low pressure. This method is widely used for purposes such as dust-proofing, waterproofing, vibration resistance, impact resistance, insulation, and housing functionality. In this catalog, we introduce a case where the process was improved by switching from potting to hot melt molding for waterproof sealing of LED modules. 【Conventional Method: Silicone Potting】 - A bathtub for polycarbonate molded products is created. - The module is placed in the case and secured. - Silicone resin is poured in and cured by heating for 80 minutes. ↓ 【Hot Melt Molding Method】 - Two modules are set on the mold. - Pressing the molding start button completes the sealing in 40 seconds. *For more details, please refer to the catalog or feel free to contact us.

  • Other molds
  • Coating Agent
  • Other electronic parts

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Introduction video for waterproof sealing of electrical components using hot melt molding.

Complete sealing of electrical components in just a few dozen seconds. Waterproof, dustproof, and insulated. We will introduce the introduction process and case studies of hot melt molding in a 5-minute video.

"Hot melt molding," which is expanding as a waterproof sealing method for electrical components to replace potting. Compared to traditional two-component potting, the following advantages are being recognized, leading to its adoption: - Extremely short curing time. Hot melt molding completes sealing in just a few seconds. - Possibility of miniaturization and lightweight design. Since hot melt molding is directly insert molded into electrical components, it eliminates the need for a case, allowing for greater design freedom and achieving miniaturization and lightweight construction. - Sustainable materials. The PA-based hot melt we handle is derived from natural plant oils and is environmentally friendly. We have compiled the process for adopting hot melt molding and examples of adopted products into a video of about five minutes. Please check the video link below.

  • Other polymer materials
  • Coating Agent
  • Other electronic parts

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[Technology Introduction] Hot Melt Molding

Unique development of molds and molding units for hot melt! Molding is possible at low pressure and low temperature!

The hot melt molding of the Nakagawa Electric Group began with the supply of in-vehicle components for hybrid vehicles. Through repeated trial and error regarding materials, surface roughness, gate positions, and cooling circuits, we developed unique molds and molding units. Compared to conventional potting molding, our process allows for molding at low pressure and low temperature. Additionally, as a result of our unique research and development, we have minimized damage to circuit connections while enabling weight reduction and miniaturization. Furthermore, by using transparent materials, it is easy to check the circuit connections even after molding. 【Features】 ■ Molding at low pressure and low temperature ■ Minimizing damage to circuits *For more details, please refer to the PDF document or feel free to contact us.

  • Other Auto Parts
  • Other optical parts
  • Other machine elements

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